This inventor holds 2 USPTO granted patents. Top assignee: Powertech Technology Inc.. Active years: 2009-2017.
Location History:
- Hsinchu, TW (2009)
- Hsinchu County, TW (2017)
Company Filing History:
Years Active: 2009-2017
Title: Chi-Chung Yu: Innovator in Semiconductor Technology
Introduction
Chi-Chung Yu is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for chip packaging and substrate design.
Latest Patents
Chi-Chung Yu's latest patents include a method for manufacturing a chip package having a coating layer. This method involves mounting at least one chip package structure onto a terminal-protection film, which seals the back side of the structure while allowing a coating layer to be formed over the top side and lateral sides. The terminals remain exposed, ensuring functionality. Another significant patent is for a universal substrate for a semiconductor device that features selectively activated fuses. This substrate design allows for various chips to be connected without the need for replacing or manufacturing new substrates, enhancing versatility in semiconductor applications.
Career Highlights
Chi-Chung Yu is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging and testing. His innovative approaches have contributed to the advancement of technologies that are crucial for modern electronic devices.
Collaborations
Chi-Chung has collaborated with notable colleagues such as Shih-Chun Chen and Sheng-I Huang, further enhancing the innovative environment at Powertech Technology Inc.
Conclusion
Chi-Chung Yu's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence advancements in chip packaging and substrate design.