The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Aug. 03, 2016
Powertech Technology Inc., Hsinchu County, TW;
Shih-Chun Chen, Hsinchu County, TW;
Sheng-I Huang, Hsinchu County, TW;
Ying-Lin Chen, Hsinchu County, TW;
Ta-Hao Chang, Hsinchu County, TW;
I-Fong Wu, Hsinchu County, TW;
Chi-Chung Yu, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.