Company Filing History:
Years Active: 2003-2011
Title: Innovations of Chew Beng Chye
Introduction
Chew Beng Chye is a prominent inventor based in Singapore, known for his contributions to integrated circuit technology. With a total of 8 patents, he has made significant advancements in the field, particularly in the design and functionality of integrated circuit devices.
Latest Patents
One of his latest patents involves integrated circuit devices with stacked package interposers. This innovative IC device includes a die and a first package interposer stacked over a second package interposer. The design features a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer, along with a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another variant of this IC device includes a second die stacked over a separate first die, with a first package interposer stacked over a separate second package interposer. In this configuration, the first die is stacked over the first interposer, establishing a first conductive connection from a bond pad of the first die directly to a bond pad of the first interposer, and a second conductive connection from a bond pad of the second die directly to a bond pad of the second interposer.
Career Highlights
Chew Beng Chye is currently employed at Micron Technology Incorporated, where he continues to innovate and develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in enhancing the performance and efficiency of integrated circuits.
Collaborations
Throughout his career, Chew has collaborated with notable colleagues, including Neo Chee Peng and Tan Hock Chuan. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.
Conclusion
Chew Beng Chye's contributions to integrated circuit technology exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the future of the semiconductor industry.