The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Jul. 28, 2005
Neo Chee Peng, Singapore, SG;
Tan Hock Chuan, Singapore, SG;
Ho Kian Seng, Singapore, SG;
Chew Beng Chye, Singapore, SG;
Lim Guek Har, Singapore, SG;
Tan Kok Chua, Singapore, SG;
Neo Chee Peng, Singapore, SG;
Tan Hock Chuan, Singapore, SG;
Ho Kian Seng, Singapore, SG;
Chew Beng Chye, Singapore, SG;
Lim Guek Har, Singapore, SG;
Tan Kok Chua, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.