Singapore, Singapore

Lim Guek Har


Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 116(Granted Patents)


Location History:

  • Sinagapore, SG (2005)
  • Singapore, SG (2003 - 2006)

Company Filing History:


Years Active: 2003-2006

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3 patents (USPTO):Explore Patents

Title: Lim Guek Har: Innovator in Semiconductor Technology

Introduction

Lim Guek Har is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and safety of semiconductor wafer cutting processes.

Latest Patents

One of Lim Guek Har's latest patents is a method and apparatus for cutting semiconductor wafers. This invention addresses the issue of improperly mounted wafer saw blades, which can damage the wafers during the cutting process. The invention employs sensors to measure the distance to the blade, helping to indicate if the blade is improperly mounted. In one method, the distance to the blade face is measured as the blade rotates, and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. The apparatus includes a blade and a sensor that monitors the distance to the face of the rotating blade. A processor coupled to the sensor indicates if the distance deviates too far from a baseline position of the blade face.

Career Highlights

Lim Guek Har is currently employed at Micron Technology Incorporated, where he continues to innovate in the semiconductor industry. His expertise in wafer cutting technology has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Lim has collaborated with notable colleagues such as Neo Chee Peng and Tan Hock Chuan. These collaborations have further enhanced his contributions to the field.

Conclusion

Lim Guek Har is a distinguished inventor whose work in semiconductor technology has led to important advancements in wafer cutting processes. His innovative patents and collaborations reflect his commitment to improving industry standards.

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