The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2008
Filed:
Aug. 17, 2004
Neo Chee Peng, Singapore, SG;
Tan Hock Chuan, Singapore, SG;
Chew Beng Chye, Singapore, SG;
David Chai Yih Ming, Singapore, SG;
Michael Tan Kian Shing, Singapore, SG;
Neo Chee Peng, Singapore, SG;
Tan Hock Chuan, Singapore, SG;
Chew Beng Chye, Singapore, SG;
David Chai Yih Ming, Singapore, SG;
Michael Tan Kian Shing, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.