The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Nov. 24, 2009
Chew Beng Chye, Singapore, SG;
Tan Kian Shing Michael, Singapore, SG;
Tan Hock Chuan, Singapore, SG;
Neo Chee Peng, Singapore, SG;
Chew Beng Chye, Singapore, SG;
Tan Kian Shing Michael, Singapore, SG;
Tan Hock Chuan, Singapore, SG;
Neo Chee Peng, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.