Company Filing History:
Years Active: 2009-2011
Title: Innovations by Tan Kian Shing Michael
Introduction
Tan Kian Shing Michael is a notable inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit devices, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of integrated circuits through innovative designs.
Latest Patents
One of his latest patents involves integrated circuit devices with stacked package interposers. This invention includes an IC device that comprises a die and a first package interposer stacked over a second package interposer. The design features a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer, along with a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another aspect of this patent includes a second die stacked over a separate first die, with a first package interposer stacked over a separate second package interposer. The first die is positioned over the first interposer, establishing a first conductive connection from a bond pad of the first die directly to a bond pad of the first interposer, and a second conductive connection from a bond pad of the second die directly to a bond pad of the second interposer.
Career Highlights
Tan Kian Shing Michael is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing the technology used in various electronic devices.
Collaborations
He collaborates with talented coworkers, including Chew Beng Chye and Tan Hock Chuan, who contribute to the innovative environment at Micron Technology.
Conclusion
Tan Kian Shing Michael's contributions to integrated circuit technology exemplify the spirit of innovation in the field. His patents reflect a commitment to advancing electronic device functionality and efficiency.