Hsinchu, Taiwan

Cheng-Ting Tseng

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Cheng-Ting Tseng: Innovator in Wafer Transfer Technology

Introduction

Cheng-Ting Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer transfer systems. His innovative approach has led to the development of a unique patent that enhances the efficiency of wafer handling.

Latest Patents

Cheng-Ting Tseng holds a patent for a "Wafer transfer system with temperature control apparatus." This invention features a temperature control apparatus designed to manage the thermal conditions of wafers during transfer. The system allows for the flow of materials, elements, or atomic particles to either heat or cool the wafers effectively. The apparatus is preferably a thermoelectric device that includes alternating N-type and P-type semiconductor pellets, which are arranged electrically in series and thermally in parallel. This design is connected to a DC power supply, with a switch or relay to alter the direction of current flow.

Career Highlights

Cheng-Ting Tseng is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his notable coworkers include Chih-Wei Chang and Fa-Yuan Chang. Their collective expertise contributes to the innovative environment at Taiwan Semiconductor Manufacturing Company Limited.

Conclusion

Cheng-Ting Tseng's contributions to wafer transfer technology exemplify the spirit of innovation in the semiconductor industry. His patent reflects a commitment to enhancing the efficiency and effectiveness of wafer handling processes.

Profile summary based on public USPTO records.
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