Cheng-Hung Shen

Title: Cheng-Hung Shen: Innovator in Three-Dimensional Integrated Circuits

Introduction

Cheng-Hung Shen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuits, particularly in the development of three-dimensional structures that enhance performance and efficiency. With a total of 2 patents, his work is recognized for its innovative approach to semiconductor technology.

Latest Patents

Cheng-Hung Shen's latest patents include a method for fabricating three-dimensional integrated circuits. This method involves several steps, starting with the formation of transistors over a substrate. An interconnect structure is then created over the first transistors, followed by the application of a dielectric layer. Subsequently, 2D semiconductor seeds are formed and annealed, leading to an epitaxy process that allows for the lateral growth of 2D semiconductor films. Finally, second transistors are formed on these films, resulting in a sophisticated integrated circuit structure.

Career Highlights

Throughout his career, Cheng-Hung Shen has worked with notable organizations, including Taiwan Semiconductor Manufacturing Company Ltd. and National Yang Ming Chiao Tung University. His experience in these institutions has allowed him to collaborate with leading experts in the field, further enhancing his contributions to semiconductor technology.

Collaborations

Cheng-Hung Shen has collaborated with esteemed colleagues such as Chenming Hu and Shu-Jui Chang. These partnerships have played a crucial role in advancing his research and innovations in integrated circuits.

Conclusion

Cheng-Hung Shen's work in three-dimensional integrated circuits exemplifies the innovative spirit of modern semiconductor research. His patents and collaborations reflect a commitment to pushing the boundaries of technology, making him a significant figure in the field.