Cheng-Chi Lee

Title: Innovations of Cheng-Chi Lee

Introduction

Cheng-Chi Lee is a notable inventor based in Tu-Cheng, Taiwan. He has made significant contributions to the field of heat-dissipation technology, holding a total of 7 patents. His work focuses on innovative methods and apparatuses that enhance the efficiency of heat management systems.

Latest Patents

One of his latest patents is a method for making a heat-dissipation device that incorporates a vacuum chamber and a working fluid. This method involves several steps, including vacuuming a hollow metal casing until it reaches a predetermined vacuum degree, sealing the casing, and filling it with a working fluid. The apparatus designed for this process includes a vacuum pump, a liquid-storage tank, and a processing device, allowing for the manufacturing of the heat-dissipation device in a single location without the need for transferring the casing.

Another significant patent by Cheng-Chi Lee is a method of manufacturing a heat pipe. This invention features a powder feeding apparatus that utilizes a vibration tray and a mandrel inserted into pipes for efficient powder feeding. The vibration source drives the tray to vibrate, ensuring that the pipes receive the powder uniformly, which enhances the manufacturing process of heat pipes.

Career Highlights

Cheng-Chi Lee is currently employed at Foxconn Technology Co., Ltd., a leading technology company known for its manufacturing capabilities. His work at Foxconn has allowed him to develop and refine his innovative ideas in heat-dissipation technology.

Collaborations

Cheng-Chi Lee has collaborated with several talented individuals in his field, including Chuen-Shu Hou and Chao-Nien Tung. These collaborations have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Cheng-Chi Lee's contributions to heat-dissipation technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the industry and improve the efficiency of thermal management systems.