The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2009

Filed:

Jul. 13, 2006
Applicants:

Tay-jian Liu, Tu-Cheng, TW;

Chao-nien Tung, Tu-Cheng, TW;

Chih-hsien Sun, Tu-Cheng, TW;

Chuen-shu Hou, Tu-Cheng, TW;

Cheng-chi Lee, Tu-Cheng, TW;

Inventors:

Tay-Jian Liu, Tu-Cheng, TW;

Chao-Nien Tung, Tu-Cheng, TW;

Chih-Hsien Sun, Tu-Cheng, TW;

Chuen-Shu Hou, Tu-Cheng, TW;

Cheng-Chi Lee, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/16 (2006.01); G01K 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.


Find Patent Forward Citations

Loading…