The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7849597 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 14, 2010

Filed:

Mar. 20, 2006
Applicants:

Tay-jian Liu, Guangdong, CN;

Chao-nien Tung, Guangdong, CN;

Cheng-chi Lee, Guangdong, CN;

Chuen-shu Hou, Guangdong, CN;

Inventors:

Tay-Jian Liu, Guangdong, CN;

Chao-Nien Tung, Guangdong, CN;

Cheng-Chi Lee, Guangdong, CN;

Chuen-Shu Hou, Guangdong, CN;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 6/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method () and an apparatus for manufacturing a heat-dissipation device () with a vacuum chamber and a working fluid therein are disclosed. The method includes the following steps: vacuuming a hollow metal casing () through a first open end () thereof until an interior of the casing reaches a predetermined vacuum degree; sealing the first open end; filling a predetermined quantity of working fluid into the casing through a second open end () thereof; and sealing the second open end. The apparatus includes a vacuum pump, a liquid-storage tank and a set of processing device, as used respectively for the above vacuuming, liquid-filling and sealing steps. By this apparatus, the heat-dissipation device can be manufactured at a same place without the requirement to shift the casing from one place to another place during the manufacture of the heat-dissipation device.


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