This inventor holds 3 USPTO granted patents. Top assignee: Winbond Electronics Corporation. Active years: 2021-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021-2024
Title: Chen-Wei Liao’s Semiconductor and Memory-Structure Patents.
Introduction
Chen-Wei Liao is an inventor based in Taichung, Taiwan. His patent work includes methods for monitoring semiconductor processes and manufacturing memory structures. He is associated with Winbond Electronics Corporation and holds 3 patents.
Latest Patents
Liao’s listed patents address semiconductor manufacturing and process control.
“Method of Monitoring Semiconductor Process” describes setting a process parameter, forming a film on a wafer while leaving its edge region uncovered, and capturing an image of the wafer. Image recognition is then used to determine whether the film’s position is offset.
“Manufacturing Method for Memory Structure” describes forming spacer, protective, and mask material layers around gate stack structures. The method specifies relationships among distances associated with a void in the mask layer between adjacent gate stacks.
Career Highlights
Liao’s patent portfolio reflects work on semiconductor process monitoring and memory-structure fabrication. These inventions focus on manufacturing methods and techniques for evaluating process results.
Collaborations
Liao is associated with Winbond Electronics Corporation. His listed coworkers include Ying-Fu Tung and Che-Jui Hsu.
Conclusion
Chen-Wei Liao’s patents highlight contributions to semiconductor process monitoring and memory manufacturing, reflecting his work in Taiwan’s electronics industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
