The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Mar. 24, 2020
Winbond Electronics Corp., Taichung, TW;
Chien-Yen Liu, Taichung, TW;
Cheng-Chieh Shen, Taichung, TW;
Chung-Hsin Lai, Taichung, TW;
Chen-Wei Liao, Taichung, TW;
Winbond Electronics Corp., Taichung, TW;
Abstract
A method of monitoring a semiconductor process includes the following steps. A process parameter is set to a first condition. A first process is performed to form a first film layer on a first wafer. The first film layer does not cover a wafer edge region of the first wafer. The first wafer having the first film layer is photographed by an image capturing device to obtain a first wafer image. Image recognition is performed to the first wafer image to obtain first data. Whether a position of the first film layer is offset is determined according to the first data.