This inventor holds 6 USPTO granted patents and 6 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021-2026
Title: Chen-Hsuan Yen: Semiconductor and Chip-Package Inventions.
Introduction
Chen-Hsuan Yen is an inventor based in Taichung, Taiwan. The supplied information lists 6 patents and identifies Taiwan Semiconductor Manufacturing Company, Ltd. as her company.
Latest Patents
Yen’s listed recent inventions address semiconductor-device design and chip-package reliability.
“Semiconductor Device and Method of Making” describes a device with conductive structures surrounded by a protective ring. The ring has portions at different elevations, with regions where those portions are not vertically coincident.
“Chip Package Structure and Method for Preventing Warpage of Chip Package Structure” describes a package containing two semiconductor devices, electrically connected through a die-bonding structure. A stress-balance structure within the package carrier is designed to help prevent warpage.
Career Highlights
The supplied patent information highlights Yen’s work on protective structures for semiconductor devices and stress management in chip packaging. Both inventions concern structural approaches to device protection and package stability.
Collaborations
The supplied information names Han-Tang Lo and S. L. Chen as Yen’s coworkers. It does not specify their roles in the listed inventions.
Conclusion
Chen-Hsuan Yen’s listed patents reflect work on semiconductor-device structures and chip-package design, with particular attention to protective rings and warpage prevention.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile