The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
May. 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chen-Hsuan Yen, Hsinchu, TW;
Jen-Yuan Chang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chip package structure includes a first semiconductor device, a second semiconductor device, a die bonding structure, a package carrier and a stress balance structure. The first semiconductor device has a first redistribution structure, the second semiconductor has a second redistribution structure, and the die bonding structure is electrically connected between the first redistribution structure and the second redistribution structure. The package carrier covers the first semiconductor device and the second semiconductor device, and the stress balance structure is disposed in the package carrier.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile