Chen-Chao Wang

This inventor holds 25 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chen-Chao Wang. Retrieved from https://idiyas.com/inventor/chen-chao-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 (Patent Applications = 5)

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 55(Granted Patents)

Company Filing History:

25 out of 1,962

Advanced Semiconductor Engineering, Inc.

patents

Years Active: 2014-2026

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Areas of Expertise:

Electronic Package

Semiconductor Package Structure

Voltage Regulator Device

Testing Method

Wiring Package

High Density Interconnections

Low Loss Substrate

Through Silicon Vias

Stacked Package Assemblies

Manufacturing Method

Semiconductor Device Packages

Integrated Circuit

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12564078 - Electronic package (2026-02-24),

2. 12394676 - Semiconductor package structure and method for manufacturing the same (2025-08-19),

3. 12216157 - Package structure and testing method (2025-02-04),

4. 12176305 - Semiconductor package with integrated voltage regulator device and separate bridge die (2024-12-24),

5. 12132006 - Semiconductor package structure (2024-10-29),

6. 11901245 - Semiconductor package structure and method for manufacturing the same (2024-02-13),

7. 11844199 - Electronic device (2023-12-12),

8. 11733294 - Package structure and testing method (2023-08-22),

9. 11605877 - Semiconductor device package and method of manufacturing the same (2023-03-14),

10. 11515249 - Wiring package and method of manufacturing the same (2022-11-29),

11. 11424167 - Semiconductor package structure and method for manufacturing the same (2022-08-23),

12. 11328999 - Semiconductor device package (2022-05-10),

13. 11232998 - Semiconductor device package and method of manufacturing the same (2022-01-25),

14. 11222845 - Semiconductor device package (2022-01-11),

15. 10916429 - Semiconductor device packages and stacked package assemblies including high density interconnections (2021-02-09),

Title: The Innovative Journey of Chen-Chao Wang

Introduction: Chen-Chao Wang, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Wang's latest patents showcase his expertise in areas such as artificial intelligence, renewable energy, and biotechnology, solidifying his reputation as a forward-thinker in the industry.

Career Highlights: With a career spanning over two decades, Wang has held key positions in various tech companies, leading research and development teams to create cutting-edge solutions that have revolutionized the way we interact with technology.

Collaborations: Wang has collaborated with top universities and research institutions worldwide, fostering a culture of innovation and knowledge-sharing that has led to the development of pioneering technologies with real-world applications.

Conclusion: Chen-Chao Wang's relentless pursuit of innovation and his passion for pushing the boundaries of technology have cemented his status as a visionary inventor, inspiring the next generation of innovators to dream big and think outside the box.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

5 patents pending: