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For the Inventor, By the Inventor

Taipei, Taiwan

Chee Key Chung

This inventor holds 6 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2007-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chee Key Chung. Retrieved from https://idiyas.com/inventor/chee-key-chung-i4vafs8o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 39(Granted Patents)


Location History:

  • Penang, MY (2007 - 2010)
  • Tainan, TW (2010)
  • Taipei, TW (2017 - 2018)

Company Filing History:

goldMedal6 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2007-2018

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6 patents (USPTO):Explore Patents
1. 9887110 - Substrate warpage control using temper glass with uni-directional heating (2018-02-06),
2. 9754849 - Organic-inorganic hybrid structure for integrated circuit packages (2017-09-05),
3. 7750450 - Stacked die package with stud spacers (2010-07-06),
4. 7701069 - Solder interface locking using unidirectional growth of an intermetallic compound (2010-04-20),
5. 7692301 - Stitched micro-via to enhance adhesion and mechanical strength (2010-04-06),
6. 7229913 - Stitched micro-via to enhance adhesion and mechanical strength (2007-06-12),
Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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