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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9887110 B1

PDFFull Text
Date of Patent:
Feb. 06, 2018

Filed:

Sep. 27, 2014

Substrate warpage control using temper glass with uni-directional heating

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Chee Key Chung, Taipei, TW;

Takashi Shuto, Tsukuba, JP;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Angel Roman

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/48 (2006.01); H01L 21/687 (2006.01); H01L 21/324 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/4846 (2013.01); H01L 21/67098 (2013.01); H01L 21/68721 (2013.01); H01L 21/68785 (2013.01); H01L 21/3247 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a heat source from a single direction; and modifying a shape of the package substrate. An apparatus including a first and second supporting substrates, the first supporting substrate including a two-dimensional area that is 75 percent to 95 percent of the area of the first side of the package substrate and the second supporting substrate including a two-dimensional area that is at least equivalent to the area of a package substrate and each of the first supporting substrate and the second supporting substrate include a body having a cavity therein such that when assembled on opposite sides of a package substrate, each cavity has a volume dimension such that the body of the supporting substrate is not in contact with an area of a package substrate.

Find Patent Forward Citations

Chung, Chee. (2018). Substrate warpage control using temper glass with uni-directional heating (U.S. Patent No. 9887110). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9887110

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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