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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9754849 B1

PDFFull Text
Expired
Date of Patent:
Sep. 05, 2017

Filed:

Dec. 23, 2014

Organic-inorganic hybrid structure for integrated circuit packages

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Plory Huang, New Taipei, TW;

Henry Su, Taipei, TW;

Chee Key Chung, Taipei, TW;

Ryan Ong, Taipei, TW;

Jones Wang, Da-Xiang, TW;

Daniel Hsieh, Taipeti, TW;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt P.C.

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 23/15 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83192 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01);
Abstract

An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.

Find Patent Forward Citations

Huang, Plory. (2017). Organic-inorganic hybrid structure for integrated circuit packages (U.S. Patent No. 9754849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9754849

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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