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For the Inventor, By the Inventor

Newton, MA, United States of America

Charles R Shipley

USPTO Granted Patents = 15

Average Co-Inventor Count = 1.9

ph-index = 11

Forward Citations = 870(Granted Patents)


Location History:

  • Newton, MA (US) (1979 - 1997)
  • Auburndale, MA (US) (2003 - 2005)

Company Filing History:

goldMedal14 out of 522 
 
Shipley Company LLC
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 1979-2005

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15 patents (USPTO):Explore Patents
1. 6944945 - Sequential build circuit board (2005-09-20),
2. 6824665 - Seed layer deposition (2004-11-30),
3. 6804881 - Multilayer circuit board manufacturing process (2004-10-19),
4. 6759596 - Sequential build circuit board (2004-07-06),
5. 6582581 - Sequential build circuit board plating process (2003-06-24),
6. 6506979 - Sequential build circuit board (2003-01-14),
7. 5691395 - Process of making flexible circuits and imaged coatings (1997-11-25),
8. 5563011 - Color filter assembly (1996-10-08),
9. 5366846 - Photoimageable compositions comprising polybutadiene having internal (1994-11-22),
10. 5334488 - Method for manufacture of multilayer circuit board (1994-08-02),
11. 5262280 - Radiation sensitive compositions (1993-11-16),
12. 5246817 - Method for manufacture of multilayer circuit board (1993-09-21),
13. 4902610 - Method for manufacture of multilayer circuit board (1990-02-20),
14. 4439516 - High temperature positive diazo photoresist processing using polyvinyl (1984-03-27),
15. 4152164 - Electroless nickel plating (1979-05-01),

Sure, here is an article about inventor Charles R. Shipley:

Title: Unveiling the Ingenious Inventor - Charles R. Shipley

Introduction:

Charles R. Shipley, a prolific inventor based in Newton, MA, has made significant contributions to the field of technology with an impressive portfolio of 15 patents. His innovative approach to problem-solving has paved the way for groundbreaking advancements in circuit board manufacturing and copper seed layer deposition.

Latest Patents:

Among his latest patents is the "Sequential Build Circuit Board," a revolutionary method for the manufacture of circuit boards that involves selective plating of metallic reinforcing members, solder mount pads, and signal interconnections. The resulting boards are notably free of traditional glass fiber reinforcement, setting a new standard for durability and performance. Additionally, Shipley's "Seed Layer Deposition" patent outlines novel techniques for depositing copper seed layers on substrates with small apertures, offering a solution tailored for intricate electronic components.

Career Highlights:

Throughout his career, Charles R. Shipley has been associated with Shipley Company, L.L.C., where his expertise and innovative spirit have flourished. His pioneering work in the field of circuit board technology has established him as a thought leader in the industry, with a reputation for delivering cutting-edge solutions to complex engineering challenges.

Collaborations:

Collaborating closely with esteemed colleagues such as James G. Shelnut and Robert L. Goldberg, Shipley has leveraged the power of teamwork to drive innovation and achieve remarkable results. Their collective efforts have led to the development of novel technologies that have garnered recognition and praise within the tech community.

Conclusion:

In conclusion, Charles R. Shipley's remarkable journey as an inventor exemplifies the power of imagination, determination, and collaboration in pushing the boundaries of technological innovation. His groundbreaking patents and unwavering dedication to excellence continue to inspire future generations of inventors to dream big and create a better tomorrow.

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