Shipley Company LLC

Other

Charles R Shipley

James G Shelnut

Robert L Goldberg

Daniel Y Pai

Philip D Knudsen

Michael Gulla

Oleh B Dutkewych

David Merricks

George J Cernigliaro

Howard A MacKay

A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Sequential build circuit board

Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Seed layer deposition

A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Multilayer circuit board manufacturing process

The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention. Preferred methods of the invention include applying a dielectric coating onto a support; forming recesses in the dielectric coating that define openings including opening for at least one reinforcing member; depositing copper metal into the recesses to form a first layer; applying a second dielectric coating onto the first circuit layer; forming recesses in the second dielectric coating that define openings including openings for at least one reinforcing member in registration with the one or more reinforcing members in the first layer; depositing metal into the recesses in the dielectric coating to form the second layer; and repeating the process to form sequential build board having the desired number of layers.

A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Sequential build circuit board plating process

A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Process of making flexible circuits and imaged coatings

A color filter assembly comprising a topcoat layer which comprises a composition, wherein the composition in general comprises a crosslinking agent and a reactive resin binder, i.e., a resin that can undergo self-condensation and/or crosslinking with one or more other components of the composition upon thermal treatment or other activation. Preferred resin binders include those resins that contain pendant polar functional groups, particularly acidic moieties such as carboxyl (COOH) and/or hydroxyl (OH). Acrylic resins containing such groups are particularly preferred. Compositions of the invention exhibit low thickness loss and have exceptional light transmission properties. Compositions of the invention are also useful as carriers for pigments and dyes for forming color filter elements.

Color filter assembly

Photoimageable compositions comprising polybutadiene having internal

The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.

Method for manufacture of multilayer circuit board

Radiation sensitive compositions

The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.

This invention is for a photoresist capable of withstanding temperatures in excess of 200.degree. C. without image distortion. The photoresist comprises a high temperature diazo sensitizer, preferably an ester or amide of an o-quinone diazide sulfonic or carboxylic acid chloride, in a binder comprising a polyvinyl phenol. The sensitizer and polyvinyl phenol react with each other at elevated temperature. The sensitizer has a secondary decomposition temperature and the polyvinyl phenol has a flow temperature at least equal to the temperature where reaction between the two occurs.

High temperature positive diazo photoresist processing using polyvinyl

This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.

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Newton, MA, United States of America

Charles R Shipley