The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Oct. 17, 2001
Applicant:
Inventors:
James G. Shelnut, Northboro, MA (US);
David Merricks, Coventry, GB;
Oleh B. Dutkewych, Chatham, MA (US);
Charles R. Shipley, Auburndale, MA (US);
Assignee:
Shipley Company, L.L.C., Marlborough, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 2/802 ; H01L 2/1288 ;
U.S. Cl.
CPC ...
C23C 2/802 ; H01L 2/1288 ;
Abstract
Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
Published as: