Company Filing History:
2 out of 1,139 
1 out of 5 Years Active: 2022-2023
Title: Chao Gu: Innovator in Acoustic Device Packaging
Introduction
Chao Gu is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of acoustic devices. With a total of 3 patents, his work focuses on enhancing the performance and efficiency of acoustic devices through innovative packaging structures.
Latest Patents
One of Chao Gu's latest patents is titled "Packaging structure and method of acoustic device." This invention relates to the technical field of semiconductors and includes a substrate with a piezoelectric stack structure. The design features a first organic material layer and a second organic material layer, which work together to create acoustic reflection structures. These structures help reduce the loss of acoustic waves, thereby improving the overall performance of the acoustic device.
Another notable patent is the "Manufacturing method of integrated circuit packaging structure." This method outlines the steps for disposing one or more dies on a packaging substrate and forming an encapsulation material to encapsulate these dies. The process also includes creating a heat dissipation structure, which is essential for maintaining the efficiency of integrated circuits.
Career Highlights
Chao Gu has worked with several notable companies, including Yangtze Memory Technologies Co., Ltd. and Wuhan Memsonics Technologies Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the semiconductor industry.
Collaborations
Chao Gu has collaborated with talented individuals such as Peng Chen and Houde Zhou. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.
Conclusion
Chao Gu is a distinguished inventor whose work in acoustic device packaging has made a significant impact in the semiconductor field. His innovative patents and collaborations highlight his commitment to advancing technology and improving device performance.
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