Yangtze Memory Technologies Co., Ltd.

Wuhan Memsonics Technologies Co., Ltd.

Chao Gu

Peng Chen

Houde Zhou

Yan Liu

Bowoon Soon

Bangtao Chen

Binghui Lin

Zhipeng Ding

Qin Ren

BaoHua Zhang

Weiliang Teo

Liyan Siow

The disclosure provides a packaging structure and method of an acoustic device, relating the technical field of semiconductors, including: a substrate and a piezoelectric stack structure located on the substrate, a first organic material layer is disposed on the piezoelectric stack structure, a second organic material layer is disposed on the first organic material layer, the first organic material layer includes a first supporting part and a second supporting part, the second supporting part forms a first acoustic reflection structure, when being transmitted to the first acoustic reflection structure, acoustic waves can be reflected back to the effective area, so that the loss of the acoustic waves is reduced, and the performance of the acoustic device is improved. The first supporting part is matched with the second organic material layer to form a second acoustic reflection structure, so that when part of acoustic waves are not reflected back by the first acoustic reflection structure and are transmitted to the second acoustic reflection structure, the acoustic waves can be reflected back to the effective area, so that the loss of the acoustic waves is further reduced, and the performance of the acoustic device is improved.

Packaging structure and method of acoustic device

A manufacturing method of an integrated circuit (IC) packaging structure includes the following steps. One or a plurality of dies is disposed on a packaging substrate. An encapsulation material is formed on the packaging substrate. The encapsulation material is configured to encapsulate the one or the plurality of the dies on the packaging substrate. At least one trench is formed in the encapsulation material. A heat dissipation structure is formed on the encapsulation material, and at least a part of the heat dissipation structure is formed in the at least one trench. The step of forming the heat dissipation structure includes the following steps. A first slurry is formed in the at least one trench, and a first curing process is performed to the first slurry for forming a first portion of the heat dissipation structure.

Manufacturing method of integrated circuit packaging structure

An electronic component includes a substrate comprising a die attach region and a perimeter region on a front side of the substrate; and at least one thermal indicator disposed within the perimeter region for monitoring the cumulative heat exposure of the substrate. The thermal indicator signals when the predetermined thermal budget limit that correlates with the decline in the condition of the OSP layer or the degradation of the adhesion of the die attach films is reached.

Electronic component comprising substrate with thermal indicator

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Wuhan, China

Chao Gu