ChanHoon Ko

Title: Innovations of ChanHoon Ko in Integrated Circuit Packaging

Introduction

ChanHoon Ko is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of five patents. His work focuses on innovative methods of manufacturing integrated circuit packaging systems that enhance performance and efficiency.

Latest Patents

One of ChanHoon Ko's latest patents is an "Integrated circuit packaging system with redistribution layer and method of manufacture thereof." This patent describes a method that involves forming a peripheral interconnect with a bond finger and a contact pad, connecting an integrated circuit die to the bond finger, and encapsulating the module. Another notable patent is the "Integrated circuit packaging system with package on package support and method of manufacture thereof." This invention outlines a process that includes providing a substrate, mounting a die, and covering it with encapsulant while exposing a central region of the interposer.

Career Highlights

ChanHoon Ko is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuit technology. His expertise and dedication have positioned him as a key figure in the development of advanced packaging solutions.

Collaborations

Throughout his career, ChanHoon Ko has collaborated with talented individuals such as HeeJo Chi and NamJu Cho. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

ChanHoon Ko's contributions to integrated circuit packaging are noteworthy and reflect his commitment to innovation. His patents demonstrate a deep understanding of manufacturing processes that enhance the functionality of electronic devices.