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For the Inventor, By the Inventor

Taichung, Taiwan

Chang-Lun Lu

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 96(Granted Patents)


Company Filing History:

goldMedal15 out of 823 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2016-2020

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15 patents (USPTO):Explore Patents
1. 10796970 - Method for fabricating electronic package (2020-10-06),
2. 10461002 - Fabrication method of electronic module (2019-10-29),
3. 10403570 - Method for fabricating electronic package (2019-09-03),
4. 10242972 - Package structure and fabrication method thereof (2019-03-26),
5. 10211082 - Fabrication method of electronic package (2019-02-19),
6. 10201086 - Electronic device (2019-02-05),
7. 10141233 - Electronic package and fabrication method thereof (2018-11-27),
8. 10128178 - Electronic package and method for fabricating the same (2018-11-13),
9. 9899309 - Electronic package and semiconductor substrate (2018-02-20),
10. 9831191 - Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package (2017-11-28),
11. 9818635 - Carrier structure, packaging substrate, electronic package and fabrication method thereof (2017-11-14),
12. 9735075 - Electronic module and fabrication method thereof (2017-08-15),
13. 9601403 - Electronic package and fabrication method thereof (2017-03-21),
14. 9515039 - Substrate structure with first and second conductive bumps having different widths (2016-12-06),
15. 9263380 - Semiconductor interposer and package structure having the same (2016-02-16),

Title: Innovations of Chang-Lun Lu in Electronic Packaging

Introduction

Chang-Lun Lu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 15 patents. His work focuses on improving the efficiency and functionality of electronic modules and packages.

Latest Patents

Among his latest patents is a method for fabricating an electronic package. This innovation includes a first circuit structure with a plurality of first electronic elements disposed on its surface. It features at least one first conductive element formed on the surface and a first encapsulant that encapsulates the electronic elements and the conductive element, with a portion of the conductive element exposed. This design eliminates the need for a packaging substrate with a core layer, thereby reducing the thickness of the electronic package. Another notable patent is the fabrication method of an electronic module, which includes an electronic element and a strengthening layer. This layer is formed on the side surface of the electronic element, preventing damage during handling.

Career Highlights

Chang-Lun Lu is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing electronic packaging technologies. His innovative approaches have garnered attention in the industry and contributed to the company's reputation for excellence.

Collaborations

Chang-Lun Lu has collaborated with notable coworkers, including Lu-Yi Chen and Shih-Ching Chen. Their combined expertise has led to significant advancements in their projects.

Conclusion

Chang-Lun Lu's contributions to electronic packaging through his innovative patents and collaborative efforts highlight his importance in the field. His work continues to influence the development of more efficient electronic modules and packages.

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