The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Oct. 17, 2016
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Lu-Yi Chen, Taichung, TW;

Cheng-Hsiang Liu, Taichung, TW;

Chang-Lun Lu, Taichung, TW;

Jun-Cheng Liao, Taichung, TW;

Cheng-Yi Chen, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/111 (2013.01); H05K 3/341 (2013.01); H05K 3/3442 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/10636 (2013.01);
Abstract

An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.


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