Cheng-Yi Chen

Title: Innovations of Cheng-Yi Chen in Electronic Packaging

Introduction

Cheng-Yi Chen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 6 patents. His work focuses on improving the manufacturing processes and structural integrity of electronic packages.

Latest Patents

Cheng-Yi Chen's latest patents include innovative methods for manufacturing electronic packages. One notable patent describes a method characterized by encapsulating an electronic component with a packaging layer. This method also involves forming a circuit structure on the upper surface of the packaging layer that is electrically connected to the electronic component. Additionally, a stress-balancing layer is formed on a portion of the lower surface of the packaging layer. This design helps to balance the stress exerted on both surfaces, thereby reducing overall package warpage and facilitating the manufacturing process.

Career Highlights

Throughout his career, Cheng-Yi Chen has worked with notable companies such as Siliconware Precision Industries Co., Ltd. and the Industrial Technology Research Institute. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic packaging technology.

Collaborations

Cheng-Yi Chen has collaborated with several talented individuals in his field, including Jyun-Kai Ciou and Chao-Feng Sung. These collaborations have further enhanced his innovative capabilities and have led to the development of cutting-edge technologies.

Conclusion

Cheng-Yi Chen's contributions to electronic packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the manufacturing processes and structural designs of electronic components, paving the way for future advancements.