The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Mar. 30, 2016
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Shih-Ching Chen, Taichung, TW;
Shih-Liang Peng, Taichung, TW;
Chieh-Lung Lai, Taichung, TW;
Jia-Wei Pan, Taichung, TW;
Chang-Lun Lu, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 29/02 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4846 (2013.01); H01L 23/3128 (2013.01); H01L 23/3142 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15151 (2013.01);
Abstract
A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.