Taichung, Taiwan

Jia-Wei Pan

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2018.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations by Jia-Wei Pan in Semiconductor Technology

Introduction

Jia-Wei Pan is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique electronic package and semiconductor substrate.

Latest Patents

Jia-Wei Pan holds 1 patent for his invention titled "Electronic package and semiconductor substrate." This patent describes a semiconductor substrate that includes a substrate body with a lateral surface and a protruding structure extending outward from that surface. The design effectively distributes stresses generated during the manufacturing process, preventing issues such as delamination or cracking. Additionally, the patent encompasses an electronic package that utilizes this advanced semiconductor substrate.

Career Highlights

Jia-Wei Pan is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work at this organization has allowed him to focus on innovative solutions that enhance the reliability and performance of electronic components.

Collaborations

Throughout his career, Jia-Wei Pan has collaborated with talented individuals such as Shih-Ching Chen and Chieh-Lung Lai. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jia-Wei Pan's contributions to semiconductor technology exemplify the importance of innovation in the electronics industry. His patented designs not only improve manufacturing processes but also enhance the overall quality of electronic products.

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