This inventor holds 2 USPTO granted patents. Top assignee: National Semiconductor Corporation. Active years: 2006-2007.
Company Filing History:
Years Active: 2006-2007
Title: Innovations by Chan Chee Ling in Micro-Array Integrated Circuit Packaging
Introduction
Chan Chee Ling is an accomplished inventor based in Negeri Sembilan, Malaysia. She has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. Her work focuses on improving the efficiency and effectiveness of micro-array integrated circuit packages.
Latest Patents
One of her latest patents is titled "Method of Fabricating a Micro-Array Integrated Circuit Package." This innovative method involves applying a B-stageable adhesive to a wafer, which is then diced into individual dice. These dice are attached to a lead-frame using their adhesive and are wirebonded to associated leads. The lead-frame is encapsulated, and solder connectors are applied, allowing for faster and more efficient production of BGA-type packages.
Another notable patent is "Die Attach Region for Use in a Micro-Array Integrated Circuit Package." This patent describes a die attach region that employs interconnected posts and support risers to uphold a semiconductor die. This design facilitates the flow of encapsulant material underneath the die during encapsulation, enhancing the manufacturing process. The die attach region can be integrated into a lead-frame structure or a substrate panel for improved efficiency.
Career Highlights
Chan Chee Ling is currently employed at National Semiconductor Corporation, where she continues to innovate in the field of semiconductor technology. Her work has been instrumental in advancing the capabilities of micro-array integrated circuits.
Collaborations
Throughout her career, Chan has collaborated with notable colleagues, including Jaime A Bayan and Ashok S Prabhu. These collaborations have contributed to her success and the development of her innovative patents.
Conclusion
Chan Chee Ling's contributions to the field of integrated circuit packaging demonstrate her expertise and commitment to innovation. Her patents reflect a deep understanding of the complexities involved in semiconductor manufacturing, paving the way for more efficient production methods.