National Semiconductor Corporation

Chan Chee Ling

Jaime A Bayan

Ashok S Prabhu

Chan Peng Yeen

Santhiran S/o Nadarajah

Hasfiza Ramley

Lye Meng Kong

Santhiran S O Nadarajah

A method of fabricating a micro-array IC package is recited. A wafer has a B-stageable adhesive applied, and the wafer is diced. The individual dice are applied to a lead-frame via their adhesive, and wirebonded to associated leads. The lead-frame is then encapsulated, and solder connectors are applied. The lead-frame is then singulated to produce a plurality of lead-frame based micro-array packages. The process thus allows lead-frame based manufacturing methods to be employed in the production of BGA-type packages, allowing such packages to be produced faster and more efficiently.

Method of fabricating a micro-array integrated circuit package

A die attach region for use in an IC package is described. The die attach region employs a number of posts interconnected with a number of support risers to provide a structure that upholds a semiconductor die while facilitating flow of an encapsulant material underneath the die during encapsulation. The posts and risers can be arranged in a number of configurations that each facilitate flow of encapsulant material. This die attach region can be incorporated into a lead-frame structure or a substrate panel for ease and efficiency of manufacture.

Die attach region for use in a micro-array integrated circuit package

Growing community of inventors

Negeri Sembilan, Malaysia

Chan Chee Ling