Company Filing History:
6 out of 25 
1 out of 1 
1 out of 2 Years Active: 2003-2014
Title: Innovator Spotlight: Chan Boon Meng
Introduction
Chan Boon Meng, an accomplished inventor hailing from Ipoh, Malaysia, has made significant contributions to the field of semiconductor packaging. With a total of eight patents to his name, Chan's innovations focus on enhancing the efficiency and effectiveness of light-emitting diodes (LED) and integrated circuit packages.
Latest Patents
Among his latest patents, Chan has developed groundbreaking methods for manufacturing LED packages and integrated circuit packages.
1. **LED Packages:** This innovative method incorporates a large panel frame/substrate that is substantially square-shaped and mounted to a ring. It features a matrix pattern of die pads, each with a planar chip attach surface where the LED chip is securely attached. An encapsulant material is applied over the LED chips and portions of the frame, allowing for the separation of each die pad and its corresponding leads to form individual LED packages once the manufacturing process is complete.
2. **Large Panel Leadframe:** Similar to his LED technology, this method involves a square-shaped large panel leadframe. It includes a matrix of die pads, each to which an integrated circuit chip is attached. The encapsulant material is again applied to cover the chips and part of the leadframe, enabling the separation of die pads and leads for the creation of individual integrated circuit packages. Both patented processes involve meticulous steps performed while the components are mounted to a taped ring, illustrating Chan's commitment to precision engineering.
Career Highlights
Chan has held notable positions in reputable companies, including Carsem (M) Sdn. Bhd. and Carsem Semiconductor Sdn. Bhd. His work in these organizations has been pivotal in the advancement of semiconductor technologies, and his innovative approaches have significantly impacted the industry.
Collaborations
Throughout his career, Chan has collaborated with talented individuals, including his coworkers Yong Lam Wai and Phang Hon Keat. Their collective efforts have contributed to various projects, fostering an environment of innovation and shared expertise.
Conclusion
Chan Boon Meng exemplifies what it means to be an innovative inventor in the realm of semiconductor technology. With his impressive portfolio of patents and collaborative spirit, he continues to influence the industry, paving the way for future advancements in LED and integrated circuit packaging. His dedication to innovation serves as an inspiration for aspiring inventors worldwide.