The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Oct. 05, 2007
Lee Kock Huat, Ipoh, MY;
Chan Boon Meng, Ipoh, MY;
Cheong Mun Tuck, Ipoh, MY;
Lee Huan Sin, Melaka, MY;
Phuah Kian Keung, Ipoh, MY;
Araventhan Eturajulu, Ipoh, MY;
Liow Eng Keng, Ipoh, MY;
Thum Min Kong, Perak, MY;
Chen Choon Hing, Perak, MY;
Lee Kock Huat, Ipoh, MY;
Chan Boon Meng, Ipoh, MY;
Cheong Mun Tuck, Ipoh, MY;
Lee Huan Sin, Melaka, MY;
Phuah Kian Keung, Ipoh, MY;
Araventhan Eturajulu, Ipoh, MY;
Liow Eng Keng, Ipoh, MY;
Thum Min Kong, Perak, MY;
Chen Choon Hing, Perak, MY;
Carsem (M) Sdn. Bhd., Kuala Lumpur, MY;
Abstract
The present invention relates to a stress-free lead frame () for a semiconductor. The stress-free lead frame () is provided with a stress-relief means () and an interlocking means () at the outer periphery. The stress-relief means () is capable of accommodating expansion and compression while the interlocking means () take care of shock and vibration during handling to thereby eliminate delamination of the lead frame ().