Phuah Kian Keung

Title: Innovator in Semiconductor Technology: Phuah Kian Keung

Introduction

Phuah Kian Keung is a notable inventor based in Ipoh, Malaysia, who has made significant contributions to the field of semiconductor technology. With a total of five patents to his name, his work focuses on advanced packaging techniques and lead frame designs that enhance the performance and reliability of integrated circuits.

Latest Patents

Among his latest inventions, Phuah has developed a patent for "Molded Integrated Circuit Packages and Methods of Forming the Same." This innovative package design features a leadframe with a first die attached, utilizing bond wires to connect the die to the leadframe. The molded package body encapsulates portions of the components while creating a cavity for improved functionality. Additionally, he holds a patent for a "Stress-Free Lead Frame," which incorporates stress-relief and interlocking means to accommodate expansion and handling shocks. This invention aims to solve delamination issues commonly faced in lead frame applications.

Career Highlights

Phuah's career includes key positions at renowned companies such as Carsem (M) Sdn. Bhd. and Carsem Semiconductor Sdn. Bhd. His experience in these organizations has allowed him to apply his inventive skills in practical settings, ultimately leading to his impactful patents.

Collaborations

Throughout his career, Phuah has collaborated with talented individuals like Lee Kock Huat and Chan Boon Meng. These partnerships have enriched his research and innovation processes, fostering an environment of shared ideas and expertise.

Conclusion

Phuah Kian Keung exemplifies an innovative spirit in the semiconductor industry, with his contributions making a lasting impact on technology. His patents not only highlight his technical skills but also reflect his commitment to advancing the field through meaningful inventions.