The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Jun. 22, 2001
Applicant:
Inventors:
Lee Kock Huat, Ipoh, MY;
Chan Boon Meng, Ipoh, MY;
Phuah Kian Keung, Ipoh, MY;
Lee Huan Sin, Melaka, MY;
Cheong Mun Tuck, Ipoh, MY;
Assignee:
Carsem Semiconductor SDN. BHD., Perak, MY;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
The present invention relates to a new method for sawing a moulded leadframe package ( ) into individual integrated circuits ( ). In the present invention sawing of the moulded leadframe package ( ) is done on the leads ( ) instead of on the connecting bar ( ) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.