Carsem (m) Sdn. Bhd.

Carsem Semiconductor Sdn. Bhd.

Carsen Semiconductor Sdn. Bhd.

Phuah Kian Keung

Chan Boon Meng

Cheong Mun Tuck

Lee Huan Sin

Lee Kock Huat

Thum Min Kong

Chen Choon Hing

Araventhan Eturajulu

Liow Eng Keng

Lily Khor

A package is disclosed. The package includes a leadframe, and a first die, attached to the leadframe. The package also includes first bond wires, each attached to one of the first bond pads of the first die and to one of the leads of the leadframe, and a package body molded over each of a portion of the die pad of the leadframe, a portion of the leads of the leadframe, a first portion of the first die, and one or more of the first bond wires. The molded package body defines a cavity, and a second portion of the first die contacts neither of the die pad and the package body. The package also includes a second die having second bond pads, where the second die is attached to the first die. The package also includes second bond wires, each attached to the first and second die.

Molded integrated circuit packages and methods of forming the same

The present invention relates to a stress-free lead frame () for a semiconductor. The stress-free lead frame () is provided with a stress-relief means () and an interlocking means () at the outer periphery. The stress-relief means () is capable of accommodating expansion and compression while the interlocking means () take care of shock and vibration during handling to thereby eliminate delamination of the lead frame ().

Stress-free lead frame

The present invention relates to a new method for sawing a moulded leadframe package ( ) into individual integrated circuits ( ). In the present invention sawing of the moulded leadframe package ( ) is done on the leads ( ) instead of on the connecting bar ( ) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.

Method for sawing a moulded leadframe package

Growing community of inventors

Ipoh, Malaysia

Phuah Kian Keung