Carsem (m) Sdn. Bhd.

Carsem Semiconductor Sdn. Bhd.

Carsen Semiconductor Sdn. Bhd.

Chan Boon Meng

Phuah Kian Keung

Yong Lam Wai

Lee Kock Huat

Cheong Mun Tuck

Lee Huan Sin

Phang Hon Keat

Liow Eng Keng

Thum Min Kong

Chen Choon Hing

Araventhan Eturajulu

A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring.

Light emitting diode (LED) packages

A method of manufacturing an integrated circuit package includes mounting a large panel leadframe having a substantially square shape to a ring. The large panel leadframe includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. An integrated circuit chip is attached to each of the die pads. An encapsulant material is applied over the integrated circuit chips and at least a part of the large panel leadframe. Each of the die pads and its corresponding leads are separated from the large panel leadframe to form individual integrated circuit packages. The steps of attaching the integrated circuit chips and applying the encapsulant material are performed while the large panel leadframe is mounted to a taped ring.

Large panel leadframe

Manufacturing light emitting diode (LED) packages

An LED package includes a die pad having a bottom surface, an upper surface and a centrally located recessed cavity. The recessed cavity has a chip attach surface between the bottom surface and upper surface and sidewalls that extend from the recessed chip attach surface to the upper surface. The package additionally has leads arranged on opposing sides of the die pad. The leads have a bottom surface that is coextensive with the bottom surface of the die pad and an upper surface coextensive with the upper surface of the die pad. An LED chip is attached to the chip attach surface. The package further includes a package body having an encapsulant which fills space between the die pad and leads forming a bottom encapsulant surface that is coextensive with the bottom surfaces of the die pad and leads.

Leadframe package with recessed cavity for LED

The present invention relates to a stress-free lead frame () for a semiconductor. The stress-free lead frame () is provided with a stress-relief means () and an interlocking means () at the outer periphery. The stress-relief means () is capable of accommodating expansion and compression while the interlocking means () take care of shock and vibration during handling to thereby eliminate delamination of the lead frame ().

Stress-free lead frame

The present invention relates to a new method for sawing a moulded leadframe package ( ) into individual integrated circuits ( ). In the present invention sawing of the moulded leadframe package ( ) is done on the leads ( ) instead of on the connecting bar ( ) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.

Method for sawing a moulded leadframe package

Growing community of inventors

Ipoh, Malaysia

Chan Boon Meng