The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2012

Filed:

May. 24, 2011
Applicants:

Yong Lam Wai, Ipoh, MY;

Chan Boon Meng, Ipoh, MY;

Phang Hon Keat, Ipoh, MY;

Inventors:

Yong Lam Wai, Ipoh, MY;

Chan Boon Meng, Ipoh, MY;

Phang Hon Keat, Ipoh, MY;

Assignee:

Carsem (M) SDN. BHD., Perak Darul Ridzuan, MY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/00 (2006.01); H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LED package includes a die pad having a bottom surface, an upper surface and a centrally located recessed cavity. The recessed cavity has a chip attach surface between the bottom surface and upper surface and sidewalls that extend from the recessed chip attach surface to the upper surface. The package additionally has leads arranged on opposing sides of the die pad. The leads have a bottom surface that is coextensive with the bottom surface of the die pad and an upper surface coextensive with the upper surface of the die pad. An LED chip is attached to the chip attach surface. The package further includes a package body having an encapsulant which fills space between the die pad and leads forming a bottom encapsulant surface that is coextensive with the bottom surfaces of the die pad and leads.


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