Company Filing History:
Years Active: 2018-2023
Title: Innovations of Chai-Chi Lin
Introduction
Chai-Chi Lin is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on enhancing semiconductor device packaging and manufacturing methods.
Latest Patents
Chai-Chi Lin's latest patents include a semiconductor device package and a method of manufacturing the same. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate, while the active component is placed on the substrate and electrically connected to the antenna. Notably, the location of the antenna is adjustable concerning the active component. Another patent involves a semiconductor substrate that includes an interconnection structure and a dielectric layer. The dielectric layer surrounds the interconnection structure and defines a first cavity, which is characterized by a first sidewall, a second sidewall, and a first surface of the dielectric layer.
Career Highlights
Chai-Chi Lin is associated with Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His innovative approaches have contributed to advancements in the industry.
Collaborations
Some of his notable coworkers include Chih-Cheng Lee and Hsing Kuo Tien, who collaborate with him on various projects within the semiconductor field.
Conclusion
Chai-Chi Lin's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in semiconductor device packaging and manufacturing methods.