Advanced Semiconductor Engineering, Inc.

Chai-Chi Lin

Chih-Cheng Lee

Hsing Kuo Tien

Yuanhao Yu

Hong Jie Chen

Chung Ju Yu

Chih-Yung Yang

Jui-Hsien Wang

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.

Semiconductor device package and method of manufacturing the same

A semiconductor substrate includes an interconnection structure and a dielectric layer. The dielectric layer surrounds the interconnection structure and defines a first cavity. The first cavity is defined by a first sidewall, a second sidewall, and a first surface of the dielectric layer. The first sidewall is laterally displaced from the second sidewall.

Semiconductor device and method of manufacturing the same

Growing community of inventors

Kaohsiung, Taiwan

Chai-Chi Lin