Nepean, Canada

Cameron Mcknight-Macneil

USPTO Granted Patents = 10 

 

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 48(Granted Patents)


Company Filing History:


Years Active: 2015-2024

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10 patents (USPTO):Explore Patents

Title: Cameron Mcknight-Macneil: Innovator in Power Semiconductor Packaging

Introduction

Cameron Mcknight-Macneil is a notable inventor based in Nepean, Canada. He has made significant contributions to the field of power semiconductor devices, holding a total of 10 patents. His work focuses on improving the reliability and performance of embedded die packaging for high voltage and high temperature applications.

Latest Patents

Mcknight-Macneil's latest patents include innovative designs for solder resist structures in embedded die packaging. One of his patents addresses the challenges associated with conventional solder resist coatings, which often develop cracks at high-stress points. His design omits inside corners in the solder resist layout, significantly enhancing resistance to crack initiation and propagation. Another patent details the embedded die packaging for power semiconductor devices, utilizing a laminated body with dielectric and conductive layers. This design is particularly beneficial for GaN HEMT devices rated for operation at 100V or higher, ensuring improved reliability in demanding conditions.

Career Highlights

Throughout his career, Mcknight-Macneil has worked with prominent companies in the semiconductor industry, including Gan Systems Inc. and Infineon Technologies Canada Inc. His expertise in power semiconductor technology has positioned him as a key player in the development of advanced packaging solutions.

Collaborations

Mcknight-Macneil has collaborated with several professionals in his field, including Greg P Klowak and Ahmad Mizan. These partnerships have contributed to the advancement of innovative technologies in power semiconductor packaging.

Conclusion

Cameron Mcknight-Macneil's contributions to the field of power semiconductor devices through his patents and collaborations highlight his role as a leading inventor. His innovative approaches to embedded die packaging continue to influence the industry positively.

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