The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Dec. 12, 2014
Applicant:

Gan Systems Inc., Ottawa, CA;

Inventors:

Gregory P. Klowak, Ottawa, CA;

Cameron McKnight-MacNeil, Nepean, CA;

Howard Tweddle, Carp, CA;

Ahmad Mizan, Kanata, CA;

Nigel Springett, Emmendingen, DE;

Assignee:

GaN Systems Inc., Ottawa, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/768 (2006.01); H01L 31/113 (2006.01); H01L 21/82 (2006.01); H01L 21/336 (2006.01); H01L 21/66 (2006.01); H01L 29/20 (2006.01); H01L 29/201 (2006.01); H01L 29/205 (2006.01); H01L 29/778 (2006.01); H01L 27/095 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/528 (2013.01); H01L 27/095 (2013.01); H01L 29/201 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/7787 (2013.01);
Abstract

A fault tolerant design for large area nitride semiconductor devices is provided, which facilitates testing and isolation of defective areas. A transistor comprises an array of a plurality of islands, each island comprising an active region, source and drain electrodes, and a gate electrode. Electrodes of each island are electrically isolated from electrodes of neighboring islands in at least one direction of the array. Source, drain and gate contact pads are provided to enable electrical testing of each island. After electrical testing of islands to identify defective islands, overlying electrical connections are formed to interconnect source electrodes in parallel, drain electrodes in parallel, and to interconnect gate electrodes to form a common gate electrode of large gate width Wg. Interconnections are provided selectively to good islands, while electrically isolating defective islands. This approach makes it economically feasible to fabricate large area GaN devices, including hybrid devices.


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