Embedded die packaging for power semiconductor devices

Abstract

Embedded die packaging for high voltage, high temperature operation of power semiconductor devices is disclosed, wherein a power semiconductor die is embedded in laminated body comprising a layer stack of a plurality of dielectric layers and electrically conductive layers. For example, the dielectric layers comprise dielectric build-up layers of filled or fiber reinforced dielectric and conductive interconnect comprises copper layers and copper filled vias. A dielectric build-up layer, e.g. filled or glass fiber reinforced epoxy, forms an external surface of the package covering underlying copper interconnect, particularly in regions which experience high electric field during operation, such as between closely spaced source and drain interconnect metal. For example, the power semiconductor device comprises a GaN HEMT rated for operation at ≥100V wherein the package body has a laminated structure configured for high voltage, high temperature operation with improved reliability.