Byungho Kim

Title: Byungho Kim: Innovator in Semiconductor Packaging

Introduction

Byungho Kim is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His innovative designs have advanced the technology used in semiconductor devices, making them more efficient and reliable.

Latest Patents

Among his latest patents, one notable invention is a semiconductor package that includes a package substrate with a redistribution layer. This package features a semiconductor chip that is electrically connected to the redistribution layer. Additionally, it has a wiring structure with pads arranged on its upper surface and a vertical connection structure that links the redistribution layer to the pads. A passivation layer is also included, which has openings that partially expose regions of the pads. The design of the pads is particularly interesting, as it includes a first pad adjacent to a corner of the wiring structure and a second pad closer to the center, with varying widths.

Another significant patent involves a semiconductor package that consists of a substrate and at least one semiconductor chip with chip pads. This package incorporates a redistribution wiring layer that covers the lower surface of the substrate. The wiring layer includes first and second redistribution wirings stacked in multiple levels and connected to the chip pads. The design also features dummy patterns that extend into the outer region of the wiring layer, enhancing its structural integrity.

Career Highlights

Byungho Kim has worked with leading companies in the technology sector, including Samsung Electronics and C&C Research Laboratories. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Byungho has collaborated with talented individuals such as Seongjin Shin and Chan Hee Park. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Byungho Kim's contributions to semiconductor packaging have established him as a key figure in the field. His innovative patents reflect his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.