Samsung Electronics Co., Ltd.

C&c Research Laboratories

Byungho Kim

Sang Hwi Lee

Chan Hee Park

Soon Ok Lee

Kwang Seok Ko

Junhwan Im

Seongjin Shin

Jongmin Kim

Jaehoon Choi

Mi Sun Kim

Jooyoung Choi

Hyung Jo Moon

Minjung Kong

Sung Hyun Moon

Doohwan Lee

Taewook Kim

Hye Jung Kim

Heon Kyu Park

Jungsook Kim

Jee Hun Yun

Sangseok Hong

Hoe Moon Kim

Seunghee Kim

Bu Young Choi

A semiconductor package includes a package substrate including a redistribution layer; a semiconductor chip disposed on the package substrate and electrically connected to the redistribution layer; a wiring structure disposed on the semiconductor chip and having an upper surface on which pads are arranged; a vertical connection structure disposed between the package substrate and the wiring structure and electrically connecting the redistribution layer and the pads; and a passivation layer disposed on the wiring structure and having openings partially exposing a region of each of the pads. The pads include a first pad adjacent to a corner of the wiring structure, and a second pad closer to a center of the wiring structure than the first pad. A first width of the first pad is greater than a second width of the second pad. A contact layer is disposed in the opening on the first pad.

Semiconductor package

A semiconductor package includes a substrate, at least one semiconductor chip arranged in the substrate and having chip pads, and a redistribution wiring layer covering a lower surface of the substrate and including first and second redistribution wirings and dummy patterns, the first and second redistribution wirings being stacked in at least two levels and connected to the chip pads. The first and second redistribution wirings are arranged in a redistribution region of the redistribution wiring layer, and the dummy patterns extend in an outer region outside the redistribution region to partially cover corner portions of the redistribution wiring layer, respectively.

Semiconductor package and method of manufacturing the semiconductor package

A semiconductor package includes a semiconductor chip including a connection pad disposed on an active surface of the semiconductor chip, a passivation layer disposed on the connection pad and the active surface and having an opening exposing at least a portion of the connection pad, and a capping pad covering the connection pad exposed to the opening; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure disposed on the active surface of the semiconductor chip and including a connection via connected to the capping pad and a redistribution layer connected to the connection via, wherein the capping pad includes: a central portion disposed in the opening, and a peripheral portion extending from the central portion onto the passivation layer, and having a crystal grain having a size different from that of the crystal grain of the central portion.

Semiconductor package including capping pad having crystal grain of different size

A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.

A heterocyclic derivative represented by formula (I), or a pharmaceutically acceptable salt or a stereoisomer thereof, which has an inhibitory effect on the activation of STAT3 protein, and is useful for the prevention or treatment of diseases associated with the activation of STAT3 protein.

Heterocyclic derivatives and use thereof

Growing community of inventors

Suwon-si, South Korea

Byungho Kim