The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Sep. 26, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jooyoung Choi, Suwon-si, KR;
Taewook Kim, Suwon-si, KR;
Byungho Kim, Suwon-si, KR;
Sangseok Hong, Suwon-si, KR;
Jaehoon Choi, Suwon-si, KR;
Seongjin Shin, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.