Seongjin Shin

Title: Seongjin Shin: Innovator in Semiconductor Packaging

Introduction

Seongjin Shin is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents involves a semiconductor package that includes a package substrate with a redistribution layer. This innovative design features a semiconductor chip that is electrically connected to the redistribution layer. Additionally, it incorporates a wiring structure with pads arranged on its upper surface and a vertical connection structure that links the redistribution layer to the pads. A passivation layer is also included, which has openings that partially expose regions of each pad. Notably, the first pad adjacent to a corner of the wiring structure has a greater width than the second pad, which is closer to the center.

Another significant patent by Seongjin Shin describes a semiconductor package and a method for manufacturing it. This package consists of a substrate with at least one semiconductor chip that has chip pads. A redistribution wiring layer covers the lower surface of the substrate, featuring first and second redistribution wirings stacked in multiple levels and connected to the chip pads. The design also includes dummy patterns that extend into an outer region, partially covering the corner portions of the redistribution wiring layer.

Career Highlights

Seongjin Shin is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Seongjin Shin has collaborated with notable colleagues, including Byungho Kim and Jooyoung Choi. These collaborations have fostered innovation and have been instrumental in the development of new technologies in semiconductor packaging.

Conclusion

Seongjin Shin's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing. His work continues to influence the industry and pave the way for future advancements.